| 1. | Capability detail specification : multilayer printed boards
多层印制板.能力详细规范 |
| 2. | Sectional specification - multilayer printed boards
多层印制板分规范 |
| 3. | Cause of multilayer printed board ' s warp and the countermeasure
多层印制电路板翘曲成因与对策 |
| 4. | Sectional specification : multilayer printed boards ; german version en 123300 : 1992
分规范.多层印制电路板 |
| 5. | Specification for base materials for rigid and multilayer printed boards
硬质多层印制电路板基底材料的规范 |
| 6. | Specification for flexible multilayer printed boards with through conections
有贯穿连接的挠性多层印制板规范 |
| 7. | Specification for flex - rigid multilayer printed boards with through connections
有贯穿连接的刚挠多层印制板规范 |
| 8. | Sectional specification : multilayer printed boards ; german version en 123300 : 1992 a1 : 1995
分规范:多层印制电路板 |
| 9. | Build - up multilayer printed board
积层扰印制板 |
| 10. | Rigid multilayer printed board
扰性多层印制板 |
